AMD Ryzen 7 PRO 6850H
Released in Q2 2022, the AMD Ryzen 7 PRO 6850H is a powerful laptop processor featuring the Rembrandt (Zen 3+) architecture, built on a 6 nm process. It includes 8 cores and 16 threads, with a base frequency of 3.2GHz and a turbo boost up to 4.7GHz. It supports LPDDR5-6400 and DDR5-4800 memory with a maximum capacity of 64GB and a bandwidth of 76.8GB/s. Integrated with AMD Radeon 680M graphics, the GPU operates between 2GHz and 2.2GHz. The processor consumes 45W and can reach up to 54W under turbo. Benchmark scores include 78 (Cinebench 2024 Single-core) and 13147 (Cinebench R23 Multi-core), demonstrating robust performance.

AMD Ryzen 7 PRO 6850H

Released in Q2 2022, the AMD Ryzen 7 PRO 6850H is a powerful laptop processor featuring the Rembrandt (Zen 3+) architecture, built on a 6 nm process. It includes 8 cores and 16 threads, with a base frequency of 3.2GHz and a turbo boost up to 4.7GHz. It supports LPDDR5-6400 and DDR5-4800 memory with a maximum capacity of 64GB and a bandwidth of 76.8GB/s. Integrated with AMD Radeon 680M graphics, the GPU operates between 2GHz and 2.2GHz. The processor consumes 45W and can reach up to 54W under turbo. Benchmark scores include 78 (Cinebench 2024 Single-core) and 13147 (Cinebench R23 Multi-core), demonstrating robust performance.
General Parameters | |
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Release Date | Q2 2022 |
Manufacturer | AMD |
Type | Laptop |
Instruction Set | x86-64 |
Core Architecture | Rembrandt (Zen 3+) |
PCI Express | N/A |
PCIE Version | 4 |
Integrated Graphics | Yes |
Test in benchmarks
Performance test of AMD Ryzen 7 PRO 6850H in benchmarks
PassMark
Cinebench 2024
Cross-platform benchmark reference for high-performance processors
Cinebench R23
Cross-platform benchmark reference for high-performance processors
Cinebench R20
Cross-platform benchmark reference for high-performance processors
Geekbench 6
The new version of this benchmark reference emulates common operations often used in real-world applications.
Geekbench 5
The previous version of this benchmark reference emulates common operations often used in real-world applications.
Others
Package | |
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Fabrication Process | 6 nm |
Socket | FP7 |
Energy Consumption | 45 W |
Max Temp | 105ºC |
CPU Performance | |
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Main Cores | 8 |
Main Threads | N/A |
Main Cores Base Freq. | N/A |
Main Cores Turbo Freq. | 4.7GHz |
Total Cores | 8 |
Total Threads | 16 |
Bus Frequency | N/A |
Multiplier | N/A |
L1 Cache | N/A |
L2 Cache | 4MB |
L3 Cache | 16MB |
Unlocked Multiplier | No |
Memory Parameters | |
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Memory Types | LPDDR5-6400,;DDR5-4800 |
Max Memory | 64GB |
Max. Memory Channels | 2 |
Max Bandwidth | N/A |
ECC Memory Support | N/A |
GPU Parameters | |
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Integrated Graphics | Yes |
GPU Base Frequency | 2GHz |
Dynamic Max GPU Frequency | 2.2GHz |
Shaders | 768 |
Texture Units | N/A |
ROP Units | N/A |
Execution Units | 12 |
Energy Consumption | N/A |
Miscellaneous | |
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PCIE Version | 4 |
PCIE Lines | N/A |